Go to https://brilliant.org/HighYield to get a 30-day free trial + the first 200 of you will get 20% off their annual subscription! AMD's MI300 combines five next-gen technologies into one 147 billion transistor chip monster. In this video we will take a closer look at the tech AMD uses to combine CDNA3 GPU cores with Zen 4 CPU cores to create the worlds first HPC AI APU and talk about AMD's strategy for reaching Zettascale in the future. Support me on Patreon: https://www.patreon.com/user?u=46978634 Follow me on Twitter: https://twitter.com/highyieldYT 0:00 Intro 0:42 Five next-gen technologies of MI300 3:19 MI300 Specs 4:36 Chiplet Design 8:06 Brilliant 9:15 Advanced Packaging / 3D Stacking 11:48 SoC / APU Design 13:15 Unified Memory 14:16 AI / ML Acceleration 15:15 AMD's Zettascale Strategy